DreamWafer
Research Papers

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DreamWafer Collaborative University and Industry Research includes the following abstract with participants and published papers:

· A Rapid Prototyping Platform for Electronic Systems - Abstract and Participants

· An Active Reconfigurable Circuit Board

Norman et al., IEEE NEWCAS-TAISA Conference, Montreal, Canada, Jun 22-25, 2008

· An Interconnection Network for a Novel Reconfigurable Circuit Board

Norman et al., IEEE NEWCAS-TAISA Conference, Montreal, Canada, Jun 22-25, 2008

· Digital Signal Propagation on a Wafer-Scale Smart Active Programmable Interconnect

Valorge et al., IEEE/ICECS International Conference on Electronics, Circuits, and Systems, Malta, Aug 31-Sep 3, 2008

· Hardware Software System Co-Verification of an Active Reconfigurable Board with System C-VHDL

Basile-Bellavance et al., IEEE/ICECS International Conference on Electronics, Circuits, and Systems, Malta, Aug 31-Sep 3, 2008

· Steady State Thermal Analysis of a Reconfigurable Wafer-Scale Circuit Board

Bougataya et al., IEEE/CCECE08 Proceedings, Niagara Falls, Canada, May 4-7, 2008

· Workflow for an Electronic Configurable Computing System

Lepercq et al., IEEE/ISCAS International Symposium on Circuits and Systems, Taipei, Taiwan, May 24-27, 2009

· Wafer Post-Processing for a Reconfigurable Wafer-Scale Circuit Board

Radji et al., EMPC-2009 European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009

· Faults Diagnosis Methodology for the WaferNet Interconnection Network

Basile-Bellavance et al., IEEE NEWCAS-TAISA Conference, Toulouse, France, June 28-July1, 2009

· An Interconnection Network for a Novel Reconfigurable Circuit Board (accepted)

Lepercq et al., MNRC Microsystems and Nanoelectronics Research, Ottawa, Canada, October 15-16, 2009