DreamWafer
Research Papers
DreamWafer Collaborative University and Industry Research includes the following abstract with participants and published papers:
- A Rapid Prototyping Platform for Electronic Systems - Abstract and Participants
- An Active Reconfigurable Circuit Board
Norman et al., IEEE NEWCAS-TAISA Conference, Montreal, Canada, Jun 22-25, 2008
- An Interconnection Network for a Novel Reconfigurable Circuit Board
Norman et al., IEEE NEWCAS-TAISA Conference, Montreal, Canada, Jun 22-25, 2008
- Digital Signal Propagation on a Wafer-Scale Smart Active Programmable Interconnect
Valorge et al., IEEE/ICECS International Conference on Electronics, Circuits, and Systems, Malta, Aug 31-Sep 3, 2008
- Hardware Software System Co-Verification of an Active Reconfigurable Board with System C-VHDL
Basile-Bellavance et al., IEEE/ICECS International Conference on Electronics, Circuits, and Systems, Malta, Aug 31-Sep 3, 2008
- Steady State Thermal Analysis of a Reconfigurable Wafer-Scale Circuit Board
Bougataya et al., IEEE/CCECE08 Proceedings, Niagara Falls, Canada, May 4-7, 2008
- Workflow for an Electronic Configurable Computing System
Lepercq et al., IEEE/ISCAS International Symposium on Circuits and Systems, Taipei, Taiwan, May 24-27, 2009
- Wafer Post-Processing for a Reconfigurable Wafer-Scale Circuit Board
Radji et al., EMPC-2009 European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009
- Faults Diagnosis Methodology for the WaferNet Interconnection Network
Basile-Bellavance et al., IEEE NEWCAS-TAISA Conference, Toulouse, France, June 28-July 1, 2009
- An Interconnection Network for a Novel Reconfigurable Circuit Board
Lepercq et al., MNRC Microsystems and Nanoelectronics Research, Ottawa, Canada, October 15-16, 2009
- Thermal Analysis of a Miniature Electronic Power Device Matched to a Silicon Wafer
Berriah et al., IEEE NEWCAS Conference, Montreal, Canada, Jun 20-23, 2010
- A Low-Power, Small-Area Voltage Reference Array for a Wafer-Scale Prototyping Platform
Laflamme-Mayer et al., IEEE NEWCAS Conference, Montreal, Canada, Jun 20-23, 2010
- Conception d’un Système de Test et de Configuration Numérique Tolérant aux Pannes
Basile-Bellavance, Mémoire Maîtrise Ès Sciences Appliquées, École Polytechnique de Montréal, Montréal, Canada, Dec 2009
- Microfabrication and Post-CMOS Integration Techniques for a Reconfigurable Wafer-Sized Circuit Board
Radji, Master thesis Master of Engineering, McGill University, Montréal, Canada, May 2010
- Electrical characterization of annular Through Silicon Vias for a Reconfigurable Wafer-sized Circuit Board
Diop et al., IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Austin, USA, Oct 25 2010
- Thermo-Mechanical Analysis of a Reconfigurable Wafer-Scale Integrated Circuit
Baddredine et al., ISCAS, Rio de Janeiro, Brazil, May 15-18, 2011
- Conception d’un Réseau de Distribution de Puissance à l’Échelle De La Tranche en Technologie CMOS
Laflamme-Mayer, Mémoire Maîtrise Ès Sciences Appliquées, École Polytechnique de Montréal, Montréal, Canada, Avril 2011
- Machine-Learning Framework for Automatic Netlist Creation
Diop et al., IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Austin, USA, Oct 25 2010
- Power Supply Analysis of a Large Area Integrated Circuit
André, IEEE NEWCAS Conference, Bordeaux, France, Jun 26-29, 2011
- A Dual-Power Rail, Low-Dropout, Fast-Response Linear Regulator
Laflamme-Mayer, IEEE NEWCAS Conference, Bordeaux, France, Jun 26-29, 2011