DreamWafer
Présentations
Les travaux de recherche menés par DreamWafer, en collaboration avec les universités et l'industrie, sont représentés ici par un résumé avec participants ainsi que plusieurs présentations:
- An Interconnection Network for a Novel Reconfigurable Circuit Board
Norman et al., IEEE NEWCAS-TAISA Conference, Montreal, Canada, Jun 22-25, 2008
- Intelligent Prototyping Workflow for Electronic Systems Using a Configurable Circuit
Lepercq et al., IEEE ISCAS International Symposium on Circuits and Systems, Taipei, Taiwan, May 24-27, 2009
- Thermal Analysis of a Miniature Electronic Power Device Matched to a Silicon Wafer
Berriah et al., IEEE NEWCAS Conference, Montreal, Canada, Jun 20-23, 2010
- WaferBoard™Rapid Prototyping Platform for Electronic Systems
Diop et al., CMC Symposium, Ottawa, Canada, Oct 14-15, 2010
- Electrical characterization of annular Through Silicon Vias for a Reconfigurable Wafer-sized Circuit Board
Diop et al., IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Austin, USA, Oct 25 2010
- Thermo-Mechanical Analysis of a Reconfigurable Wafer-Scale Integrated Circuit
Bougataya et al., 17th IEEE International Conference on electronics, Circuits, and Systems, ICECS, Athens, Greece, Dec 12-15, 2010
- Caractérisation électrique d’interconnexions avancées de type vias traversants (TSVs)
Diop et al., ACFAS, Sherbrooke, Canada, May 9-13, 2011
- Le WaferBoard™ - une plateforme de prototypage rapide pour les systèmes électroniques
Blaquière et al., ACFAS, Sherbrooke, Canada, May 9-13, 2011
- Machine-Learning Framework for Automatic Netlist Creation
Baddredine et al., ISCAS, Rio de Janeiro, Brazil, May 15-18, 2011 : Blaquière et al., ACFAS, Sherbrooke, Canada, May 9-13, 2011
- A Dual-Power Rail, Low-Dropout Fast-Response Linear Regulator
Laflamme-Mayer et al., NEWCAS, Bordeaux, France, June 26-29, 2011
- LAIC Based System Design: A Thermo-Mechanical and Power Issue
Lakhssassi et al., CMC Microsystems Symposium, Gatineau, Canada, Oct 20, 2011